LG Electronics G8 ThinQ Dual SIM
LG Electronics G8 ThinQ Dual SIM
Purchase this Teardown
Subscription Category Phones Manufacturer
Date Available April 22, 2019
Teardown Date May 27, 2019
Construction
Dimensions 151.9x71.8x8.4mm (5.98x2.83x0.33")
Weight 167gr (5.89oz)
Form Factor Touch
Usability
Display Resolution 1440x3120px
Display Size 65x141mm (2.56x5.55") ~563PPI
Display Diagonal 6.1"
Display Type 16M AMOLED
Input Capacitive Touchscreen
OS Android OS, v9.0
Vibration Available
Hardware
Chipset Qualcomm Snapdragon SDM 855
Processor 2.84GHz Qualcomm Kryo 485 & 3 Cores @ 2.42GHz Qualcomm Kryo 485 & 4 Cores @ 1.8GHz Qualcomm Kryo 485
GPU Adreno 640
RAM 6GB
Internal Memory 128GB
External Memory microSD
Camera Resolution 12 Megapixel
Camera Flash LED
Second Camera 8 Megapixel
Other Functionality Digital Compass
Fingerprint Scanner
Accelerometer
Gesture Control
Proximity Sensor
Barometer
Wireless Charging
Speaker Stereo
Battery Slot Non-removable Battery
Connectivity
NFC NFC
USB Type-C 1.0
v3.1
Bluetooth v5.0
Positioning System Integrated GPS
Audio Output 3.5mm Jack
Radio FM
Cellular Network
Network Support LTE 800(20), 1800+(3), 2600(7), 850(5), 900(8), 2100(1), 1700/2100(4), 700(17), 700(28), 700(12), 1500(32)
GSM 1800, 1900, 850, 900
UMTS 900, 850, 2100, 1900, 1700/2100
HSPA 900, 850, 2100, 1900, 1700/2100
CDMA 800, 1900
TD-LTE 2300(40), 2600(38), 5900(46), 3500(42)
LTE-A
GPRS Available
EDGE Available
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